Solder Paste, Sn96.5/Ag3/Cu0.5, 500gLFM48 TM HP(L) 500G JAR
LFM48 TM HP(L) 500G JAR - Solder Paste, Sn96.5/Ag3/Cu0.5, 500g, Almit
180-92-526
LFM48 TM HP(L) 500G JAR
Image is for illustrative purposes only. Please refer to product description.
LFM48 TM HP(L) 500G JAR - Solder Paste, Sn96.5/Ag3/Cu0.5, 500g, Almit
180-92-526
LFM48 TM HP(L) 500G JAR
Product specifications
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Datasheets
Product Information
Family Information
- Flux content 12 % of ROL 1 type
- No-clean solder paste
- Melting point of 217 °C
- Powder size 20...38 um
Legislation and compliance
RoHS
Conforms
REACH Regulation No SVHC
Signal Word Danger
Article Information
Previous Article Number
8092526
Paper catalogue
2013/14 p. 2243
Additional information
Country of origin Japan (JP)
Manufacturer Almit
Gross weight (incl. package) 543 Gram
Dimensions (incl. package) 70 x 70 x 78 MM
Customs number 3810901000
UNSPSC (v5.03) 23171509